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Add to Calendar 04/09/2026 9:00 AM 04/10/2026 4:00 PM Eastern TECHSPO New York 2026 Where Business, Tech and Innovation Collide in NYC! TECHSPO New York 2026 is a two day technology expo taking place April 9th - 10th, 2026 at the luxurious New York Marriott at the Brooklyn Bridge Hotel in New York City, NY. TECHSPO New York brings together developers, brands, marketers, technology providers, designers, innovators and evangelists looking to set the pace in our advanced world of technology. Exhibitors showcase the next generation of technology & innovation, including; Internet, Mobile, Adtech, Martech and SaaS technologies. Be prepared to be inspired, amazed and educated on how these evolving technologies will impact your business for the better. As part of TECHSPO New York are two limited attendance conferences, DigiMarCon East 2026 Digital Marketing Conference (https://digimarconeast.com) and Sales Summit East (https://salessummiteast.com). If the conferences are where the learning, theory and inspiration happens, then the TECHSPO floor is where the testing, networking and product interaction takes place. The TECHSPO floor is free to attend (for a limited time)! Register today! For more details visit https://techsponyc.com.   New York Marriott at the Brooklyn Bridge Hotel, New York City
 Co-located Event: DigiMarCon East  Super Early Bird Rates (Save $100)
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Venue

TECHSPO NYC 2026 kicks off with Registration Check-in opening at 9:00am, Thursday, 9:00am, Thursday, April 9th, 2026 at the Registration Desk located on the Second Floor of New York Marriott at the Brooklyn Bridge Hotel.

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When to Arrive / Depart

It is recommended to arrive in New York City, July 6th, 2026 (the day prior to the start of TECHSPO NYC 2026) and depart on July 9th, 2026(the day after the Conclusion of the Expo).

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Blog excerpts are publicly available online through RSS 2.0 Creative Commons License. Full attribution to the authors and source links to the original full blog posts is included. The opinions and views expressed in blog posts are the opinions of the designated authors and do not reflect the opinions or views of TECHSPO.

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